--- type: product schema_version: 1 stock_number: "79933-1" canonical_url: "https://www.artisantg.com/79933-1/Canon-ANELVA" json_url: "https://www.artisantg.com/79933-1/Canon-ANELVA.json" generated_at: "2026-11-07T09:31:55.468Z" last_updated: "2026-10-23T06:16:04.907-05:00" --- # Canon ANELVA Head Unit _Summary and Categories are this item's record. The description sections and FAQ are machine-assisted and can contain errors; where they disagree with the record, the record is correct, and where description sections disagree with each other, Details wins._ ## Summary - Manufacturer: Canon ANELVA - Condition: Used and in Excellent Condition - Price: $995.00 USD - Availability: In stock, 1 available - Warranty: 1-Year Warranty with 30-Day Return Guarantee - ITAR restricted: No - Shipping weight: 6 lb, estimated - Shipping dimensions: 14X14X6 in, estimated ## Categories - Semiconductor > Semiconductor (primary) ## Overview The head unit is designed for high-vacuum sputtering systems, providing process control for thin-film deposition. It operates on a proprietary embedded control system and interfaces with various process sensors and actuators via analog and digital I/O. Connections include power, RF/DC sources, gas controllers, and a human-machine interface (HMI) for user input and process monitoring. Common applications are in semiconductor manufacturing, data storage, and display fabrication. ## Function Designed for integration within vacuum processing systems, this head unit provides precise thin film deposition and etching capabilities critical for semiconductor, data storage, and display device manufacturing. It supports advanced physical vapor deposition (PVD) processes, including sputtering for magnetic thin films, with features enabling low-damage film formation, uniform thickness, and controlled film properties. The unit operates under high vacuum conditions and interfaces with wafer handling and cluster tool platforms, supporting 200 and 300 mm wafers and accommodating multi-cathode and oblique angle deposition techniques to meet stringent device performance and production throughput requirements. ## Platform The head unit is designed for vacuum deposition systems. It operates on a dedicated hardware platform, likely incorporating embedded processors for process control and data acquisition. Connectivity includes serial communication (RS-232/485), analog/digital I/O for sensor integration (pressure, temperature), and potentially Ethernet for networked control and monitoring. Operator interface is achieved via a local panel or remote computer. ## Application Used in high-vacuum deposition and etching processes for advanced material fabrication. Key applications include semiconductor device manufacturing, such as forming thin-film transistors, interconnects, and gate structures. Critical for producing magnetic recording heads for data storage, thin-film optical coatings, and micro-electromechanical systems (MEMS). Supports precise material engineering for novel device development and research in nanotechnology. ## Accessories Requires main control unit and power supply chassis. Connectors include a multi-pin circular connector for signal and power interface, typically 20 to 30 pins, robust locking mechanism. Also includes coaxial RF connectors for antenna interface, usually SMA type, and a USB mini-B port for firmware updates and diagnostics. Cooling fan connectors and grounding terminals are present for safe operation. Additional mounting brackets or rack adapters may be necessary depending on installation environment. ## Interface High vacuum chamber mounting flange (typically CF or ISO-K), electrical feedthrough connectors for power and control signals, thermocouple feedthrough ports, cooling water connections with quick-disconnect fittings, pressure gauge ports (KF16 or KF25), viewport windows with optical-grade glass seals, rotary motion feedthrough with O-ring seals, linear motion feedthrough mechanisms, sample holder mounting interface, shutter mechanism control port, gas inlet ports with VCR or Swagelok fittings, cryo-panel connections if equipped, electrical grounding terminals, vacuum interlock safety connections ## Images - - - -