Kulicke & Soffa 9388 LaserPro Automatic Ball Attach System
Features
- High First Pass Yields at Fine Pitch
- Efficient Space and Facilities Utilization
- Low Cost and Fast Ball Size Changeovers Requiring No Major Tooling
- Cold Processes Requiring Only Localized Heating of Individual Pads
Description
The K&S Model 9388 LaserPro is designed to attach solder balls to integrated circuit (IC) devices. The machine attaches a ball by placing it on a device bond pad, then irradiating it with laser light. The light heats the ball to a temperature sufficient to reflow the solder, thereby attaching the ball to the bond pad.
The machine features an integrated Pattern Recognition System (PRS) and a Class I laser system with laser safety interlocks to protect the user from hazardous levels of laser radiation. Device carriers and their magazines are handled by an automatic material handling system (MHS) incorporated into the 9388.
Product Family: 9388, 93-88, 93 88, 9 3 8 8
Important Notice: Please note that any additional items included with this equipment such as accessories, manuals, cables, calibration data, software, etc. are specifically listed in the above stock item description and/or displayed in the photos of the equipment. Please contact one of our Customer Support Specialists if you have any questions about what is included with this equipment or if you require any additional information.