ECI Technology SurfaceScan QC-100 SERA Surface Characterization Module
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ECI Technology SurfaceScan QC-100 SERA Surface Characterization Module

Features

  • Corrosion Resistant Stand
  • Sealed Reservoir for Test Solutions
  • Low Maintenance Reference Electrode
  • Pressure Regulator with Flowmeter

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  • Description
  • Tech Specs
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Description

The ECI Technology SurfaceScan QC-100 SERA Surface Characterization Module answers Solderability and Wire-bondability questions. The ability to solder and wirebond is a critical factor in the manufacturing of reliable Semiconductor devices. Traditional techniques, like XRF, SEM, ESCA/Auger, Dip and Look, etc., tend to be subjective, time consuming, costly, and are often unreliable. Utilizing the patented technique known as SERA (Sequential Electrochemical Reduction Analysis), the SurfaceScan measures the adhesion characteristics of your surface.

Product Family: SurfaceScan QC-100
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Specifications

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Resources

Manuals, Datasheets, Drivers, Links

ECI Technology SurfaceScan QC-100 Datasheet (pdf) 
Link to ECI Technology Website