ESI 9000 / 9300 / 9350 Laser Semiconductor Processing System
- Increased Throughput Performance
- Latest Embedded Controller
- 1.3 Micron Wavelength
The ESI Model 9000 / 9350 Laser Semiconductor Processing System offers superior results for throughput, yield and uptime performance. The patented application of the 1.3 µm wavelength laser provides critical process window capability for metal memory link materials, allowing higher levels of energy to be used to remove links without damaging the surrounding silicon. The result is cleaner link cuts with higher yields. In addition, the Model 9000 / 9350 provides high accuracy positioning and continuous wafer processing. New features of the Model 9000 / 9350 include a 2.3 µm laser spot for smaller link pitches to accommodate the latest semiconductor device shrinks. A higher rep rate laser and faster embedded controller with new software also provide substantial throughput improvements. The result is a lower cost of ownership combined with the very latest technology for improving the yield on memory devices.
Product Family: ESI-9000 ESI-9350 ESI 9000 ESI 9350 ESI9000 ESI9350, wafer cassette transfer
Important Notice: Please note that any additional items included with this equipment such as accessories, manuals, cables, calibration data, software, etc. are specifically listed in the above stock item description and/or displayed in the photos of the equipment. Please contact one of our Customer Support Specialists if you have any questions about what is included with this equipment or if you require any additional information.