ESI EzLaze3

Functions

This system performs high-precision micromachining, including cutting, drilling, and ablation, utilizing ultra-fast pulsed lasers to minimize thermal damage. It integrates a laser source, high-speed galvanometer scanners, precision motion stages, and a vision system on a robust industrial platform. Connectivity involves Ethernet for host control and digital I/O for seamless automation integration. Applications encompass medical device fabrication, semiconductor packaging, and precision component manufacturing, processing diverse materials such as metals, ceramics, and polymers.

Platforms

Operates on industrial manufacturing floors requiring stable concrete foundations with minimal vibration, integrated into automated production lines through programmable logic controllers and conveyor systems, interfaces with CAD/CAM software via Ethernet connectivity for design file transfer, connects to compressed air systems for assist gas delivery, requires three-phase electrical power with voltage regulation, communicates with material handling robots through digital I/O signals, integrates with fume extraction systems through ducted connections, operates within temperature-controlled environments with ambient ranges of 15-35°C, compatible with various substrate thicknesses on adjustable worktables with precision positioning systems.

Applications

Performs ultra-precision material ablation, micro-machining, and selective removal using a high-repetition-rate picosecond or femtosecond laser. Enables via drilling, fine line patterning, and dicing of brittle or thin substrates with sub-micron accuracy. Hardware platform: Integrates a galvanometer-based beam steering system, high-resolution vision alignment, and automated wafer/panel handling on a vibration-isolated frame. Connectivity: Features SECS/GEM host interface for factory automation, Ethernet for data logging, and digital I/O for ancillary equipment synchronization. Applications: Microelectronics packaging, FPC/PCB fabrication, display manufacturing, and MEMS production.

Accessories

Assist gas delivery system (nozzle, regulator, gas source), Fume extraction system (exhaust hood, filter), Chiller unit (coolant, hoses), Computer with control software (monitor, keyboard, mouse), Workpiece clamping system (fixture, clamps). Interfaces: DB9 serial port (communication), Ethernet (network), BNC (trigger), safety interlocks.

Interfaces

DB-25 female connector, 25 pins, for I/O. RJ45 connector for Ethernet. RS-232 serial interface, DB-9 male connector, 9 pins. Laser interlock, BNC connector.

Specifications

High-precision laser micromachining system utilizing UV DPSS laser technology for material ablation and cutting applications. Integrates galvanometer-based beam steering with telecentric f-theta lens optics for accurate positioning across 50-300mm working fields. Features real-time vision system with CCD camera for fiducial recognition and automatic alignment. Interfaces via Ethernet TCP/IP protocol with proprietary software suite supporting CAD/CAM file formats including DXF, Gerber, and GDSII. Incorporates Class 1 laser safety enclosure with interlock systems. Commonly deployed for PCB depaneling, flex circuit cutting, semiconductor wafer dicing, thin film patterning, and precision polymer machining in electronics manufacturing and research environments.

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