Asyst Technologies 300FL, S3STD, KT20 Wafer Transfer System
Configuration:
• End User Option: 9750-0010-00
Part Number: 9750-0051-01
* If you would like to purchase a specific component of this unit, please contact Artisan Technology Group Sales.
• End User Option: 9750-0010-00
Part Number: 9750-0051-01
* If you would like to purchase a specific component of this unit, please contact Artisan Technology Group Sales.
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Stock # 63500-61
Description:
Configuration:• End User Option: 9750-0010-00
Part Number: 9750-0051-01
* If you would like to purchase a specific component of this unit, please contact Artisan Technology Group Sales.
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Overview
Specifications
Datasheets / Manuals
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KLA Tencor CRS-3000 and CRS-3100 Optical Review System
Features
- 325 nm Laser and White Light Optical System
- Four White Light Objectives 5x, 50x, 100, and 150x
- 325nm 100x UV Objective
- ...
- High-Resolution Color CCD Camera
- 24-bit Integrated White Light Package
- Precision XYZ Stage
- Automatic Deskew
- Dual Pentium PC with Jaz Drive
- Auxillary 13 Inch Video Monitor
- NFS SW Interface for Ethernet
- Tencor File Format Interface
- KLARF Format Interface
- Integrated Mini-Environment
- Exhaust Blower With Interconnect Ducts
- 300mm Wafer Handler with Integrated 300mm Asyst Loadports and Hermos Carrier ID readers
- SEMI Communication/Automation Standards: E84, E87, E40, E90 and E94
- GEM/SECS 232 (SEMI-E4, E5 and E30)
- Impact ADC option
Description
The KLA-Tencor Confocal Review Station (CRS) is an automated laser/white light microscope system used for classification of defects on both bare and patterned wafers, using defect maps generated by... a variety of instruments. The CRS combines a brightfield/darkfield white-light microscope with a laser confocal microscope, automated wafer handling, and controlling software.The CRS can display any combination of a 2D focal plane image, a 3D surface image rotated to any orientation, any horizontal slice of a volume image, and vertical 2D cuts through any of the 3D images in XZ or YZ planes. The laser scan amplitude can vary for 1x, 2x, 4x, or 8x zoom within the same magnification of the microscope, providing on-screen magnification up to 20,000x with a 100x objective at Zoom level 8.
An important feature of the confocal microscope is its extremely narrow depth of focus in laser light, which makes it possible to view images of individual layers in semiconductor structures, and to resolve structural and defect features as small as 0.15 µm.
The CRS can be configured from fully manual operation to fully automated operation. There are manual and automatic options for cassette loading, wafer loading, deskew, defect inspection and analysis, image capture, data storage, and communication. The CRS can run automatically using locally stored recipes, or can receive commands and respond to them over a network.The KLA-Tencor Confocal Review Station (CRS) is an automated laser/white light microscope system used for classification of defects on both bare and patterned wafers, using defect maps generated by a variety of instruments. The CRS combines a brightfield/darkfield white-light microscope with a laser confocal microscope, automated wafer handling, and controlling software.
The CRS can display any combination of a 2D focal plane image, a 3D surface image rotated to any orientation, any horizontal slice of a volume image, and vertical 2D cuts through any of the 3D images in XZ or YZ planes. The laser scan amplitude can vary for 1x, 2x, 4x, or 8x zoom within the same magnification of the microscope, providing on-screen magnification up to 20,000x with a 100x objective at Zoom level 8.
An important feature of the confocal microscope is its extremely narrow depth of focus in laser light, which makes it possible to view images of individual layers in semiconductor structures, and to resolve structural and defect features as small as 0.15 µm.
The CRS can be configured from fully manual operation to fully automated operation. There are manual and automatic options for cassette loading, wafer loading, deskew, defect inspection and analysis, image capture, data storage, and communication. The CRS can run automatically using locally stored recipes, or can receive commands and respond to them over a network.The KLA-Tencor Confocal Review Station (CRS) is an automated laser/white light microscope system used for classification of defects on both bare and patterned wafers, using defect maps generated by a variety of instruments. The CRS combines a brightfield/darkfield white-light microscope with a laser confocal microscope, automated wafer handling, and controlling software.
The CRS can display any combination of a 2D focal plane image, a 3D surface image rotated to any orientation, any horizontal slice of a volume image, and vertical 2D cuts through any of the 3D images in XZ or YZ planes. The laser scan amplitude can vary for 1x, 2x, 4x, or 8x zoom within the same magnification of the microscope, providing on-screen magnification up to 20,000x with a 100x objective at Zoom level 8.
An important feature of the confocal microscope is its extremely narrow depth of focus in laser light, which makes it possible to view images of individual layers in semiconductor structures, and to resolve structural and defect features as small as 0.15 µm.
The CRS can be configured from fully manual operation to fully automated operation. There are manual and automatic options for cassette loading, wafer loading, deskew, defect inspection and analysis, image capture, data storage, and communication. The CRS can run automatically using locally stored recipes, or can receive commands and respond to them over a network.
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Technical Specifications
| External Frame | |
| Cleanliness | Class 1 |
| Particle Generation | <0.01 each of >0.3 µm added per 1 cm² per wafer pass in Class 1 environment |
| External Panels | Stainless Steel |
| Air Flow | Cleanroom Laminar Air |
| Vibration Isolation | 3-point Active Air Damping & Leveling |
| Frame | Plated Mild Steel; Inert Gas-welded Construction |
| Support | Transport: 3-inch Textite Wheels (4); Operation: 2.5-inch Leveling Pads (4) |
| Controls | On/Off, Emergency Off, Circuit Breakers, Laser Interlock System |
| Throughput based on 8-inch Wafers | |
| Load Wafer to 1st Deskew Point1 | 28 s |
| Manual Deskew to 1st Defect | 15 s |
| AutoDeskew : 2 point | 20 s |
| Move & Focus | 2.4 s (live laser mode, 8 mm travel) |
| Unload Wafer | 13 s |
| Image Acquisition | 5.5 s (512 × 512 × 64) |
| Image Display (512 × 512 × 64) | 2 s |
| Image Storage (512 × 512 × 64) | Surface Image:0.1 s |
| Volume Image:4.0 s | |
| Facilities | |
| Electrical - Main System | AC 240/220/208/200 V, 1ø, 30 A @ 208 V |
| Air | 80 psi, 3 scfm |
| Vacuum | 20 in. Hg, 0.5 scfm |
Manuals, Datasheets, Drivers, Links
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