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Artisan Technology Group

Chip UnZip Hypervision Low Stress Back Side Prep System

Write a reviewStock # 63680-1
1 In StockAvailable today · ships from Champaign, IL
$7,495.00USD
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Item: Hypervision Chip UnZip Low Stress Back Side Prep System · Stock # 63680-1

Item details
Part NumberChip UnZip
In Stock1
AvailableToday
LocationChampaign, IL USAships worldwide
Stock #63680-1
Ship Weight450 lbs /ea
ConditionUsed and in Excellent Condition
InspectionBefore every shipment
Warranty1-Year Warranty with 30-Day Return Guarantee
Description
This instrument was removed from service and a very good effort was made to keep all of its components and spares together. It will require some accessories (i.e. cabling, hoses, software, computer, camera or other hardware) as well as expertise in setting up such a system to become complete and ready to operate. Please contact manufacturer for pricing and availability of required software and accessories.

Configuration:
• (2) Cole-Parmer C/L 2-Channel Variable Speed Pumps and Cole-Parmer Power Supplies
• 9.5in x 10in Milling Platform
• Internal Lamp
• 9-Pin and 25-Pin Cable

Spindles Included:
• Collis 67586 30CV .750EM 3.00 PRO R0
• Renishaw mp15 uk r76277; #M/2045/0077; R52M-0210 Command
• Low Speed Endmill

View Photo of Installed Low Speed Spindle
View Photo of other Spindles
View Photo of 9.5in x 10in Milling Platform
View Photo of Other Misc Hardware


This unit does not include a CCD camera.
Stacey Z.Artisan product specialist

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Item to Inspect: 63680-1 - Hypervision Chip UnZip Low Stress Back Side Prep System

More Information

Hypervision Chip UnZip Low Stress Back Side Prep System Overview

Features:

  • Varied Diamond Composite Tooling
  • Varied Packaging Removal Tools
  • Computer Aided Mill (CAM)
  • Interlocked Design
  • Wax-In Fixtures
  • Laser Alignment Toolset
  • CMP Polishing System
Chip UnZip is a software-controlled, patented hardware process permitting the successful low-stress removal of bulk silicon from the backside of semiconductors. Chip UnZip performs comprehensive packaging removal preserving package integrity (including plastic,ceramic, copper, aluminum, polyamide and FR4 board materials)as well as silicon thinning with positional accuracy to 5µm. The tool has become the system of choice in backside package preparation and is widely used for flip-chip, BGA and micro-BGA backside inspection. The CMP polisher is ideally used on very small die, or in recessed cavities where hand polishing is difficult.

The Hypervision Chip UnZip Low Stress Back Side Prep System may still be available for purchase and support from Artisan Technology Group beyond End-Of-Life (EOL) by the manufacturer (OEM).

Low Stress Back Side Prep System Price & Specs

Hypervision Chip UnZip Low Stress Back Side Prep System Manuals, Datasheets, Drivers, Links

Hypervision Chip UnZip Low Stress Back Side Prep System Specs

Electrical Connection
Power Supply100/110/230 V
Maximum Voltage Fluctuations+5%/-10%
Frequency50/60 Hz
Connected Load.06k VA
Main Fuse6.3 A-slow
Machine Dimensions
Length33"
Depth39"
Height28"
Weight295 lbs
General
ManufacturerHypervision
ModelChip UnZip
ConditionUsed and in Excellent Condition
Product FamilyChip UnZip, Chip Un Zip, Chip Un-Zip,PC Mill 55, PC-Mill 55, PC Mill-55, PC Mill55, EM-1, EM1, EM 1

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Important Notice: Other accessories, manuals, cables, calibration data, software, etc. are not included with this equipment unless listed in the above stock item description. All prices are shown in USD.

Artisan Scientific Corporation dba Artisan Technology Group is not affiliated with or a distributor for Hypervision. The depiction, description, or sale of products featuring names, trademarks, brands, and logos is for identification and/or reference purposes only and does not indicate any affiliation with or authorization by any rights holder.

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Used and in Excellent Condition

Used equipment in excellent physical and cosmetic condition.

Warranty
1-Year Warranty with 30-Day Return Guarantee

Every item ships with Artisan's stated warranty. In-house repair capability backs it up.

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