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Chip UnZip Hypervision Low Stress Back Side Prep System

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Item: Hypervision Chip UnZip Low Stress Back Side Prep System · Stock # 63680-10

Item details
Part NumberChip UnZip
AvailabilityNot in Stock
LocationChampaign, IL USAships worldwide
Stock #63680-10
Ship Weight800 lbs /ea
ConditionUsed and in Excellent Condition
InspectionBefore every shipment
Warranty1-Year Warranty with 30-Day Return Guarantee
Description
PC Configuration:
• OS: Windows 98 SE
• Processor: Intel Celeron
• Memory: 32MB RAM
• Hard Drive: 4 GB HDD
• Keyboard, mouse, and Monitor Included

Software Installed:
• Chip Unzip 2.0
• EMCO WinNC, GE Fanuc Series Ver 13.3
• Smart Cam Connection 11.5
• CamCad Connection 7.6
• DFX Cam connection 7.6
• Production milling 11.5
• Visual CTK 11.0
• IGES Cam connection 7.6

Included Accessories:
View Photo of Low Speed Endmill
View Photo of High Speed Spindle and Renishaw MP15
View Photo of Machine Tool Coolant
View Photo of Included Manuals

This unit does not include a CCD camera.
Stacey Z.Artisan product specialist

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Item to Inspect: 63680-10 - Hypervision Chip UnZip Low Stress Back Side Prep System

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Hypervision Chip UnZip Low Stress Back Side Prep System Overview

Features:

  • Varied Diamond Composite Tooling
  • Varied Packaging Removal Tools
  • Computer Aided Mill (CAM)
  • Interlocked Design
  • Wax-In Fixtures
  • Laser Alignment Toolset
  • CMP Polishing System
Chip UnZip is a software-controlled, patented hardware process permitting the successful low-stress removal of bulk silicon from the backside of semiconductors. Chip UnZip performs comprehensive packaging removal preserving package integrity (including plastic,ceramic, copper, aluminum, polyamide and FR4 board materials)as well as silicon thinning with positional accuracy to 5µm. The tool has become the system of choice in backside package preparation and is widely used for flip-chip, BGA and micro-BGA backside inspection. The CMP polisher is ideally used on very small die, or in recessed cavities where hand polishing is difficult.

The Hypervision Chip UnZip Low Stress Back Side Prep System may still be available for purchase and support from Artisan Technology Group beyond End-Of-Life (EOL) by the manufacturer (OEM).

Low Stress Back Side Prep System Price & Specs

Hypervision Chip UnZip Low Stress Back Side Prep System Manuals, Datasheets, Drivers, Links

Hypervision Chip UnZip Low Stress Back Side Prep System Specs

Electrical Connection
Power Supply100/110/230 V
Maximum Voltage Fluctuations+5%/-10%
Frequency50/60 Hz
Connected Load.06k VA
Main Fuse6.3 A-slow
Machine Dimensions
Length33"
Depth39"
Height28"
Weight295 lbs
General
ManufacturerHypervision
ModelChip UnZip
ConditionUsed and in Excellent Condition
Product FamilyChip UnZip, Chip Un Zip, Chip Un-Zip,PC Mill 55, PC-Mill 55, PC Mill-55, PC Mill55, EM-1, EM1, EM 1

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Important Notice: Other accessories, manuals, cables, calibration data, software, etc. are not included with this equipment unless listed in the above stock item description. All prices are shown in USD.

Artisan Scientific Corporation dba Artisan Technology Group is not affiliated with or a distributor for Hypervision. The depiction, description, or sale of products featuring names, trademarks, brands, and logos is for identification and/or reference purposes only and does not indicate any affiliation with or authorization by any rights holder.

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Used and in Excellent Condition

Used equipment in excellent physical and cosmetic condition.

Warranty
1-Year Warranty with 30-Day Return Guarantee

Every item ships with Artisan's stated warranty. In-house repair capability backs it up.

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