Stock #66355-1
$3,500.00USD
2 In StockUsed and in Excellent Condition
Chip UnZip Hypervision Low Stress Back Side Prep System
Write a reviewStock # 63680-2
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Item details
| Part Number | Chip UnZip |
|---|---|
| In Stock | 1 |
| Available | Today |
| Location | Champaign, IL USAships worldwide |
| Stock # | 63680-2 |
| Ship Weight | 450 lbs /ea |
| Condition | Used and in Excellent Condition |
| Inspection | Before every shipment |
| Warranty | 1-Year Warranty with 30-Day Return Guarantee |
Description
This instrument was removed from service and a very good effort was made to keep all of its components and spares together. It will require some accessories (i.e. cabling, hoses, software, computer, camera or other hardware) as well as expertise in setting up such a system to become complete and ready to operate. Please contact manufacturer for pricing and availability of required software and accessories.
Configuration:
• 4.5in x 6.5in Milling Platform
• Internal Lamp
• 9-Pin and 25-Pin Cable
Spindle Included:
• NSK Planet 550; 1-13440; A2303449
View Photo of Installed NSK Spindle and 4.5in x 6.5in Milling Platform
View Photo of Other Misc Hardware
Configuration:
• 4.5in x 6.5in Milling Platform
• Internal Lamp
• 9-Pin and 25-Pin Cable
Spindle Included:
• NSK Planet 550; 1-13440; A2303449
View Photo of Installed NSK Spindle and 4.5in x 6.5in Milling Platform
View Photo of Other Misc Hardware
Diasholaun D.Artisan product specialist
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More Information
Hypervision Chip UnZip Low Stress Back Side Prep System Overview
Features:
- Varied Diamond Composite Tooling
- Varied Packaging Removal Tools
- Computer Aided Mill (CAM)
- Interlocked Design
- Wax-In Fixtures
- Laser Alignment Toolset
- CMP Polishing System
Chip UnZip is a software-controlled, patented hardware process permitting the successful low-stress removal of bulk silicon from the backside of semiconductors. Chip UnZip performs comprehensive packaging removal preserving package integrity (including plastic,ceramic, copper, aluminum, polyamide and FR4 board materials)as well as silicon thinning with positional accuracy to 5µm. The tool has become the system of choice in backside package preparation and is widely used for flip-chip, BGA and micro-BGA backside inspection. The CMP polisher is ideally used on very small die, or in recessed cavities where hand polishing is difficult.
The Hypervision Chip UnZip Low Stress Back Side Prep System may still be available for purchase and support from Artisan Technology Group beyond End-Of-Life (EOL) by the manufacturer (OEM).
Low Stress Back Side Prep System Price & Specs
Hypervision Chip UnZip Low Stress Back Side Prep System Description
Hypervision Chip UnZip is a specialized low stress back side preparation system engineered for precision semiconductor delayering and failure analysis applications. This advanced instrument is designed to facilitate accurate material removal from integrated circuits, enabling detailed inspection and analysis of device structures. It serves as a critical tool in laboratory and R&D environments for microelectronic sample preparation. The system features a robust milling platform, precisely sized at 4.5 inches by 6.5 inches, to accommodate various sample sizes. This design enables delicate back-side processing methodologies, minimizing sample stress during critical preparation stages, a key capability of the Chip UnZip system. It integrates high-precision mechanical components essential for controlled material removal processes, vital for semiconductor failure analysis.
This section includes content generated with the assistance of artificial intelligence (AI) tools. AI is used to increase efficiency and provide timely information. Please note that the content may not have been reviewed for accuracy or completeness. Use this information at your own discretion, and verify details independently as needed.
Hypervision Chip UnZip Low Stress Back Side Prep System Manuals, Datasheets, Drivers, Links
Hypervision Chip UnZip Low Stress Back Side Prep System Specs
| Electrical Connection | |
|---|---|
| Power Supply | 100/110/230 V |
| Maximum Voltage Fluctuations | +5%/-10% |
| Frequency | 50/60 Hz |
| Connected Load | .06k VA |
| Main Fuse | 6.3 A-slow |
| Machine Dimensions | |
| Length | 33" |
| Depth | 39" |
| Height | 28" |
| Weight | 295 lbs |
| General | |
| Manufacturer | Hypervision |
| Model | Chip UnZip |
| Condition | Used and in Excellent Condition |
| Product Family | Chip UnZip, Chip Un Zip, Chip Un-Zip,PC Mill 55, PC-Mill 55, PC Mill-55, PC Mill55, EM-1, EM1, EM 1 |
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Important Notice: Other accessories, manuals, cables, calibration data, software, etc. are not included with this equipment unless listed in the above stock item description. All prices are shown in USD.
Artisan Scientific Corporation dba Artisan Technology Group is not affiliated with or a distributor for Hypervision. The depiction, description, or sale of products featuring names, trademarks, brands, and logos is for identification and/or reference purposes only and does not indicate any affiliation with or authorization by any rights holder.
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Condition
Used and in Excellent ConditionUsed equipment in excellent physical and cosmetic condition.
Warranty
1-Year Warranty with 30-Day Return GuaranteeEvery item ships with Artisan's stated warranty. In-house repair capability backs it up.
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