Aries 725 SDL Communications Dual HSSI Rear Panel Interface

The VIAVI Solutions / JDSU / SDL Communications Aries 720/750 Series WAN Adapters are a 6-U CompactPCI featuring full hot swap compliance per PICMG 2.1 R1.0 standards. The 720 Line features a high-performance architecture with support for two modular physical interfaces. The available interface module options include front and rear panel HSSI, DS3 or E3. Typical applications for this adapter are as an intelligent T3 or FT3 interface for system level platforms. By supporting the HSSI, DS3 or E3 interface, the ARIES 720 is an ideal candidate for developers of telecommunications access products and bandwidth intensive multimedia applications. The ARIES 720 is a 6-U sized CompactPCI adapter that is based on a 32-bit PCI interface chip supporting bus mastering at a burst rate of 132 MBps per second.

The main functional components on the ARIES 720 are the i960HD66 RISC processor, the CPCI interface and the DXI HDLC Controller. The i960 processor manages packet flow between the DXI Controller, Packet RAM and Host RAM. The i960 can act as a direct PCI bus master with direct access into Host RAM or initiate DMA transfers between Packet RAM and host buffers via the PCI Interface Controller. The VLSI DXI Controller module supports both HDLC and transparent modes of operation at speeds of up to 52 Mbps. Dual 8/16 KB FIFOs are connected directly to the DXI HDLC Controller for both transmit and receive directions to provide additional packet transfer latencies. As a product of our CP/2 ArchitectureTM, the ARIES 720 is designed with two modular electrical interfaces that support RS422, V.35 (10 Mbps maximum), HSSI (34, 45 and 52 Mbps), E3 (34 Mbps) and DS3 (44.736 Mbps).