NZA 300-300 Metcal APR Reflow Nozzle 30mm x 30mm

The Metcal APR-5000 Series Array Package Rework Systems embody the spirit and ingenuity of Metcal. In sleek designs, Metcal engineers have incorporated state-of-the-art vision, and closed-loop time, temperature and airflow control. Precision placement and powerful software make the rework of complex array packages easy, fast and extremely reliable.

Economical and easy to use, the APR-5000 Series Array Package Rework Systems deliver high-end BGA/CSP functionality, moving far beyond expensive rework machines by offering unparalleled performance at an affordable price with the precision that is engineered into every Metcal system.

Design and functionality come together in the APR-5000 Array Package Rework System. Developed in direct response to current production needs and future industry trends, the APR-5000 Array Package Rework System provides closed-loop control, optimized vision and precise component placement in an ergonomically designed compact platform, just 19" x 30" (483mm x 762mm). Capable of handling boards up to 9" x 15" (229mm x 381mm), with a placement accuracy to 0.001" (0.025mm) and interconnection pitches as low as 0.012" (0.3mm), the APR-5000 Array Package Rework System is ideal for reworking smaller assemblies, such as cell phones and laptop computers, at a very competitive cost.

In addition, the APR-5000 Array Package Rework System uses standard mains voltages and self-contained pumps rather than special wiring and shop air. This allows the system to be set up and moved to any bench, without having to be fitted/plumbed in by an engineer. The APR-5000 Array Package Rework System is designed for the long term, with the ability to pre-heat boards uniformly, even those with lead-free solders, and deliver the higher solder melt temperatures necessary to rework lead-free assemblies.

The APR-5000-XLS Array Package Rework System establishes a new benchmark for the precise, cost-effective rework of the widest range of PCBs and component types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" (0.51mm x 0.25mm).

Flexible enough to perform flawlessly with various sized PCBs, the APR-5000-XLS Array Package Rework System incorporates dual stage pre-heaters and has the thermal capacity and control to execute precise profiles of both large and small PCBs, delivering uniform temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked component.