Metcal APR-5000 Array Package Rework System Base Unit
Stock # 86654-4
This Metcal APR-5000 Array Package Rework System Base Unit is used and in excellent condition. This unit ships as photoed and with accessories explicitly listed. It does not include additional accessories nor does it include software. Contact manufacturer for pricing and availability for additional accessories and software.
Configuration:
• Voltage: 115/230 VAC
• Version: Breaker
Includes:
• (1) Set of 3 Dip Transfer Plates, Apertures 28, 35, and 45 mm, Depth 0.012" (0.30 mm); Part Number: DTP-BGA
• (2) DTP Plates
• (1) Adjustable "V" Block for CSP Components, Part Number: 20987
• (1) Vacuum Pick-Up Nozzle, 12mm O/D; Part Number: VNZ-12
• (1) Calibration Kit
• (1) Nitrogen/Shop Air Input Cable
• (1) Video In Cable
• (1) RS-232 Cable
• (1) Power Supply Cable
View Photo of accessories.
If you would like to purchase an individual component of this unit, please contact Artisan Technology Group Sales for pricing and availability.
Configuration:
• Voltage: 115/230 VAC
• Version: Breaker
Includes:
• (1) Set of 3 Dip Transfer Plates, Apertures 28, 35, and 45 mm, Depth 0.012" (0.30 mm); Part Number: DTP-BGA
• (2) DTP Plates
• (1) Adjustable "V" Block for CSP Components, Part Number: 20987
• (1) Vacuum Pick-Up Nozzle, 12mm O/D; Part Number: VNZ-12
• (1) Calibration Kit
• (1) Nitrogen/Shop Air Input Cable
• (1) Video In Cable
• (1) RS-232 Cable
• (1) Power Supply Cable
View Photo of accessories.
If you would like to purchase an individual component of this unit, please contact Artisan Technology Group Sales for pricing and availability.
Show More Description
More Information
Metcal APR-5000 Series Array Package Rework Systems
Features
- Closed-Loop Time, Temperature and Airflow Control
- High-End BGA/CSP Functionality
- Easy-To-Program Software
- (...)
- Board Temperature Monitored via Integrated Flying Thermocouples
- Real-Time Adjustments Made to All Parameters
- Single Reflow/Placement Head Allowing PCBs to Remain Stationary
Description
The Metcal APR-5000 Series Array Package Rework Systems embody the spirit and ingenuity of Metcal. In sleek designs, Metcal engineers have incorporated state-of-the-art vision, and closed-loop time,(...) temperature and airflow control. Precision placement and powerful software make the rework of complex array packages easy, fast and extremely reliable.Economical and easy to use, the APR-5000 Series Array Package Rework Systems deliver high-end BGA/CSP functionality, moving far beyond expensive rework machines by offering unparalleled performance at an affordable price with the precision that is engineered into every Metcal system.
Design and functionality come together in the APR-5000 Array Package Rework System. Developed in direct response to current production needs and future industry trends, the APR-5000 Array Package Rework System provides closed-loop control, optimized vision and precise component placement in an ergonomically designed compact platform, just 19" x 30" (483mm x 762mm). Capable of handling boards up to 9" x 15" (229mm x 381mm), with a placement accuracy to 0.001" (0.025mm) and interconnection pitches as low as 0.012" (0.3mm), the APR-5000 Array Package Rework System is ideal for reworking smaller assemblies, such as cell phones and laptop computers, at a very competitive cost.
In addition, the APR-5000 Array Package Rework System uses standard mains voltages and self-contained pumps rather than special wiring and shop air. This allows the system to be set up and moved to any bench, without having to be fitted/plumbed in by an engineer. The APR-5000 Array Package Rework System is designed for the long term, with the ability to pre-heat boards uniformly, even those with lead-free solders, and deliver the higher solder melt temperatures necessary to rework lead-free assemblies.
The APR-5000-XLS Array Package Rework System establishes a new benchmark for the precise, cost-effective rework of the widest range of PCBs and component types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" (0.51mm x 0.25mm).
Flexible enough to perform flawlessly with various sized PCBs, the APR-5000-XLS Array Package Rework System incorporates dual stage pre-heaters and has the thermal capacity and control to execute precise profiles of both large and small PCBs, delivering uniform temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked component.The Metcal APR-5000 Series Array Package Rework Systems embody the spirit and ingenuity of Metcal. In sleek designs, Metcal engineers have incorporated state-of-the-art vision, and closed-loop time, temperature and airflow control. Precision placement and powerful software make the rework of complex array packages easy, fast and extremely reliable.
Economical and easy to use, the APR-5000 Series Array Package Rework Systems deliver high-end BGA/CSP functionality, moving far beyond expensive rework machines by offering unparalleled performance at an affordable price with the precision that is engineered into every Metcal system.
Design and functionality come together in the APR-5000 Array Package Rework System. Developed in direct response to current production needs and future industry trends, the APR-5000 Array Package Rework System provides closed-loop control, optimized vision and precise component placement in an ergonomically designed compact platform, just 19" x 30" (483mm x 762mm). Capable of handling boards up to 9" x 15" (229mm x 381mm), with a placement accuracy to 0.001" (0.025mm) and interconnection pitches as low as 0.012" (0.3mm), the APR-5000 Array Package Rework System is ideal for reworking smaller assemblies, such as cell phones and laptop computers, at a very competitive cost.
In addition, the APR-5000 Array Package Rework System uses standard mains voltages and self-contained pumps rather than special wiring and shop air. This allows the system to be set up and moved to any bench, without having to be fitted/plumbed in by an engineer. The APR-5000 Array Package Rework System is designed for the long term, with the ability to pre-heat boards uniformly, even those with lead-free solders, and deliver the higher solder melt temperatures necessary to rework lead-free assemblies.
The APR-5000-XLS Array Package Rework System establishes a new benchmark for the precise, cost-effective rework of the widest range of PCBs and component types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" (0.51mm x 0.25mm).
Flexible enough to perform flawlessly with various sized PCBs, the APR-5000-XLS Array Package Rework System incorporates dual stage pre-heaters and has the thermal capacity and control to execute precise profiles of both large and small PCBs, delivering uniform temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked component.The Metcal APR-5000 Series Array Package Rework Systems embody the spirit and ingenuity of Metcal. In sleek designs, Metcal engineers have incorporated state-of-the-art vision, and closed-loop time, temperature and airflow control. Precision placement and powerful software make the rework of complex array packages easy, fast and extremely reliable.
Economical and easy to use, the APR-5000 Series Array Package Rework Systems deliver high-end BGA/CSP functionality, moving far beyond expensive rework machines by offering unparalleled performance at an affordable price with the precision that is engineered into every Metcal system.
Design and functionality come together in the APR-5000 Array Package Rework System. Developed in direct response to current production needs and future industry trends, the APR-5000 Array Package Rework System provides closed-loop control, optimized vision and precise component placement in an ergonomically designed compact platform, just 19" x 30" (483mm x 762mm). Capable of handling boards up to 9" x 15" (229mm x 381mm), with a placement accuracy to 0.001" (0.025mm) and interconnection pitches as low as 0.012" (0.3mm), the APR-5000 Array Package Rework System is ideal for reworking smaller assemblies, such as cell phones and laptop computers, at a very competitive cost.
In addition, the APR-5000 Array Package Rework System uses standard mains voltages and self-contained pumps rather than special wiring and shop air. This allows the system to be set up and moved to any bench, without having to be fitted/plumbed in by an engineer. The APR-5000 Array Package Rework System is designed for the long term, with the ability to pre-heat boards uniformly, even those with lead-free solders, and deliver the higher solder melt temperatures necessary to rework lead-free assemblies.
The APR-5000-XLS Array Package Rework System establishes a new benchmark for the precise, cost-effective rework of the widest range of PCBs and component types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" (0.51mm x 0.25mm).
Flexible enough to perform flawlessly with various sized PCBs, the APR-5000-XLS Array Package Rework System incorporates dual stage pre-heaters and has the thermal capacity and control to execute precise profiles of both large and small PCBs, delivering uniform temperature control horizontally, across the surface of PCBs up to 0.25" (6.35mm) thick, and vertically between the die and ball of the reworked component.
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Technical Specifications
Manuals, Datasheets, Drivers, Links
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